henkel paste
The need to address soldering challenges, whether it be solder joint defects, solder joint reliability, solder voids, electrochemical reliability, process capability, sustainability, or other types of solder requirements is growing with increasingly more complex designs.
Solder paste jetting allows for a much quicker application process, saving both time and production costs. Moreover, LOCTITE® GC products are designed to help improve stability in jetting processes. Leveraging LOCTITE® GC solder paste technology, Henkel has developed a temperature stable solder paste capable of jetting repeatable solder deposits and delivering lifetime inside the jetting ejector system at temperatures up to 28°C and allows for storage up to 12 months without impacting long-term reliability. This is also ideally suited for pin in paste soldering applications where the solder material is dispensed through holes onto the substrate.
